The limits of optical lithography have been extended, in no small part, by innovative materials and processes that expand and improve on fundamental resist progress to provide high-resolution, robust, and cost-effective technologies for both mass production and development of future device generations. Evolutionary and ultimately revolutionary innovations continue to be required in patterning processes and resist materials to achieve the combination of resolution, edge roughness, and sensitivity required for future technology nodes at the needed technological pace. The Advances in Patterning Materials and Processes conference is the leading forum for scientists and engineers from institutes, material as well as equipment vendors, and end-users around the world to present and discuss research on the chemistry, physics, and performance of photoresists as well as other patterning materials. This conference welcomes submissions of original papers that emphasize recent advances in high-performance patterning processes and materials and their integration in established, maturing, emerging, and new lithographic technologies.

Original technical papers are solicited, but not limited to the following topics: Materials, Processes and Applications ·photoresists for EUV lithography ·photoresists for 193nm (immersion) as well as for lithography at longer wavelengths ·positive and negative tone materials and processes (PTD, NTD) ·chemistry, processing and materials science of self-assembling materials (DSA) ·topcoats: contamination and reflection control ·underlayers: reflection control, pattern transfer, process enhancement and multilayer integration ·patterning materials and processes for electron-beam and nanoimprint lithography (NIL) ·chemistry, processing, and materials science of selective deposition as an enabler for patterning. Processing and Process Control ·single and multiple patterning ·implant processing ·resist smoothing, rectification, trim and shrink ·tone inversion materials ·applied processing, including defect control and pattern collapse mitigation ·materials challenges related to etch, process control and metrology ·new processing techniques and applications, especially self-aligned strategies ·materials for photonic applications, NEMS, MEMS and MOEMS ·thick films for SOC/SIP integration. Simulation and Modeling ·resist fundamentals ·materials chemistry and processing ·assessment of patterning and materials scaling limits ·variability, stochastics, and pattern formation ·design for or simulation of new processes and applications.