2018年国际材联电子材料大会

[基本信息]

会议名称:2018年国际材联电子材料大会

International Conference on Electronics Materials 2018

所属学科:电子工程,材料科学基础学科,高分子材料,复合材料

开始日期:2018-08-20

结束日期:2018-08-24

所在国家:韩国

所在城市:韩国

具体地点:韩国 Daejeon Convention Center, Daejeon, Korea

主办单位:Materials Research Society of Korea 、International Union of Materials Research Societies

[重要日期]

摘要截稿日期:2018-01-26

[会务组联系方式]

联系电话:+82-42-472-7461

E-MAIL:secretariat@iumrs-icem2018.org

会议网站:http://www.iumrs-icem2018.org/

[会议背景介绍]

On behalf of the International Union of Materials Research Society – International Conference on Electronic Materials 2018 to be held from August 19 ~ 24, 2018 at Daejeon Convention Center in Daejeon, Korea, it is my great honor and pleasure to cordially invite you to IUMRS-ICEM 2018 Conference. As you are probably aware of, IUMRS-ICEM 2018 is a continuation in the series of the conferences among the International MRS Members, and the conference of 2018 is supported by the Material Research Society of Korea (MRS-K). The program of IUMRS-ICEM 2018 consists of 6 symposia; Electronic Materials, 2D Materials, Soft Electronics, Functional Materials, Energy and Energy Storage, and Bio-Engineering. Since the first conference was commenced, this meeting has become a fundamental ground to exchange quality results and ideas provided by the researchers and scientists within universities, industries and institutes. Furthermore, it also provides a forum to present the cutting-edge research outputs for future collaborations which would help both students and researchers within their future research studies and works to be conducted. Hence, I strongly believe that the individuals actively engaged in materials research and developments are greatly encouraged to participate in the conference and gain academic insights they have desired. The hosting city of IURMS-ICEM 2018, Daejeon has grown into a world-class science and cultural city as a result of both cultural heritage and metropolitan developments. I eagerly awaits your participation in IURMS-ICEM 2018 and looks forward to welcoming you in Daejeon, Korea. I am looking forward to meeting you in Daejeon on August 20-24, 2018. With your active participation and support, this congress will achieve a resounding success. I firmly believe that IURMS-ICEM 2018 in Daejeon will be an academically enriching, socially enjoyable, and truly memorable experience for all participants.

[征文范围及要求]

Topic S1: Electronic Material A. Topological Insulators: Materials, electronic structure, and transport properties B. Big Ideas in Novel Sensors C. Next Generation Semiconductor Materials D. Microelectronics Packaging Materials and Processing E. Printed and Flexible Devices and Sensors F. Carbon Related Materials in Honor of Nobel Laureate Prof. Suzuki Download S2: 2D Materials A. Science and Applications of Two-Dimensional Materials B. 2D Materials and Devices Beyond Graphene C. Atomic Layer Deposition for Emerging Applications D. Surfaces and Interfaces of Thin Films, Multilayers and Nano-compositers Download S3: Soft Electronics A. Organic and Polymeric Materials for Flexible and Stretchable Electronics B. Wearable and Stretchable devices C. Flexible Transistors Technologies for Large-Area Electronics S4: Functional Materials A. 3D Device Printing B. Computational Design of Advanced Materials C. Thermoelectrics Related Theory, Materials and Applications D. Emerging, Dielectric, Ferroelectric and Piezoelectric Materials E. Optical Materials and Devices G. Hybrid Materials and Processing Technologies H: Nano-Structure and Surface Engineering S5: Energy & Energy Storage A. Perovskite Solar Cells and Related Materials and Process B. Advanced and Highly Efficient Inorganic Photovoltaics Materials and Structures C. Electrochemical Energy Storage Systems D. Advanced Materials for Fuel Cell and Electrolyer Technologies E. Emerging Photovoltaic Materials and Devices S6: Bio-engineering A. Bio-Integrated Electronics B. Photonic Nanomaterials for Biomedical Applications C. Bioinspired Materials for Artificial Photosynthesis D. Emerging Advanced Materials: Polymers, Metals and Ceramics