EMAP — 2018 20th International Conference on Electronic Materials and Packaging
[基本信息]
会议名称:EMAP — 2018 20th International Conference on Electronic Materials and Packaging
所属学科:应用化学:塑料,油漆和合成材料
开始日期:2018-12-17
结束日期:2018-12-20
所在国家:China
所在城市:Hong Kong
[会务组联系方式]
会议网站:http://emap2018.ust.hk
[会议背景介绍]
The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. From the successful stories of previous EMAP conferences held in Japan, Korea, Malaysia, Singapore, and Taiwan, this annual event offers a great opportunity to unite people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentation from world-renowned speakers and sharing sessions.