ESMT- 2019 - 2nd Annual International Conference on Engineering, Smart Materials and Technologies

[基本信息]

会议名称:ESMT- 2019 - 2nd Annual International Conference on Engineering, Smart Materials and Technologies

开始日期:2019-04-20

结束日期:2019-04-21

所在国家:Japan

所在城市:Osaka International Convention Center

具体地点:Japan Osaka International Convention Center

[重要日期]

摘要截稿日期:2019-02-15

全文截稿日期:2019-04-10

[会务组联系方式]

会议网站:http://consortium-et.com/upcoming-events/esmt-annual-conference-2019/

[征文范围及要求]

Research papers related to all areas of Engineering, Technology, Applied Sciences, Computer Science, Electrical and Mechanical Engineering, Chemical and Mechanical Engineering, Information Technology and Telecommunication etc are invited for the above international conference which is expected to be attended by the authors from various countries. People without papers can also participate in this conference. Publications: All papers for the conference will be published in the Journal volume, and one Excellent Paper will be selected from each oral session. Main Tracks of the conferences but not limited to: Mechanical & Industrial Engineering Electrical and Electronics Engineering Physics Chemistry ICT Civil Engineering Management Oil, Gas, Energy & Mining Engineering Basic Sciences Applied Sciences Important Information Conference Date: April 20-21, 2019 Abstract Submission Date: April 05, 2019 Full Paper Submission Date: April 10, 2019 Early Bird Date: March 20, 2019 Manuscript Id: esmtconsortium-et.com Conference Venue: Osaka International Convention Center, Japan