会议名称:2019 8th International Conference on Advanced Materials and Engineering Materials (8th ICAMEM2019)
开始日期:2019-04-18
结束日期:2019-04-19
所在国家:China
所在城市:Hong Kong
具体地点:China Hong Kong
全文截稿日期:2019-01-31
2019 8thInternational Conference on Advanced Materials and Engineering Materials (ICAMEM2019), sponsored by X-academy, is being organized and will be held on April 18-19, 2019 in HongKong, China.
The aim of 8th ICAMEM2019 is to gather professors, researchers and scholars all over the world. ICAMEM2019 will provide leading academy and industry scientists a platform to communicate recent advances in Advanced Materials Science, Enginering Materials Research and an opportunity to establish multilateral collaborations.
The 1st International Conference on Advanced Materials and Engineering Materials 2011 (ICAMEM 2011) has been successfully held in Shenyang, China during Nov. 22-24, 2011.The 2nd International Conference on Advanced Materials and Engineering Materials 2012 (ICAMEM 2012) has been successfully held in Beijing and Shanghai, China during Dec.16-17, 2012 and Dec.29-30, 2012. The 3rd International Conference on Advanced Materials and Engineering Materials 2013 (ICAMEM 2013) has been successfully held in Singapore during Dec.14-15 2013. The 4th International Conference on Advanced Materials and Engineering Materials 2014 (ICAMEM 2014) has been successfully held in Ningbo, China during Oct.16-17, 2014 and in Hong Kong, China during Oct, 19-20, 2014. The 5th International Conference on Advanced Materials and Engineering Materials 2016 (ICAMEM 2016) has been successfully held in Hong Kong, China during April 15-16, 2016. The 6thICAMEM2017 has been held in Singapore on March 11-12, 2017 successfully. The 7th ICAMEM2018 has been held in Bangkok, Thailand on May 17-18, 2018 successfully.
The organizing committee of conference is pleased to invite prospective authors to submit their original manuscripts to 8thICAMEM 2019 The topics of 8th ICAMEM 2019 cover Advanced Materials Science, Engineering Materials Research, Materials Processing Technology and Materials Related Issue, etc.
Topics of interest for submission include, but are not limited to:
T1: Advanced Materials Science
Nanotechnology and Materials
Semi-conductor Materials
Magnetic Materials
Electronic Materials
Microelectronic Materials
Hybrid Optical materials (organic/inorganic)
Advanced Textile Materials
New Functional materials
Smart/Intelligent Materials/Intelligent Systems
Materials Physics
Materials Chemistry
Biological medical materials
Tooling Testing and Evaluation of Materials
Modeling and simulation of materials and devices
Quantum modulation based on superconductors, semiconductor and magnets
T2:Engineering Materials Research
Advanced Steels
Advanced High Temperature Structural Materials
Thin Films and Surface Engineering
Light Metals and Alloys
Metal materials
Composites and Hybrid Materials
Advanced Ceramic and Glass Materials
Disordered and amorphous materials
Novel photonic Materials and Devices
Thermal Engineering Theory and Applications
Building Materials
Green Materials
Light emitting material
Energy Generation, Harvesting and Storage Materials
Waste Engineering and Management
T3: Materials Processing Technology
Materials Forming
Materials Machining
Surface Engineering/Coatings
Welding & Joining
Low Cost Packaging Methods
Laser Processing Technology
Microwave Processing of Materials
Processing technology for Functional materials
Function test and evaluation technology for material analysis
T4: Materials Related Issue
Strength of Materials
Fabrication Technologies
Nanofabrication, nanometrology and applications
Mechanical Behavior & Fracture
Modeling, Analysis and Simulation of Manufacturing Processes
Materials and engineered structures for light control
Engineering Optimization
System Analysis and Industrial Engineering
Dynamic Mechanical Analysis, Optimization and Control
Mechanical Control and Information Processing Technology
Control of impurities, defects, traps
Material computation and design
Material Design of Computer Aided
Computer-aided manufacturing, and engineering